High Density Interconnect PCB
Argus technolgoies one of the best service provider in high density interconnect PCB HDI PCB are characterized by high-density attributes including laser microvias, fine lines and high performance thin materials.
This increased density enables more functions per unit area.
High density interconnect PCB capitalizes on the latest technologies available to increase the functionality of PCB using the same or less amount of area.
This advancement in PCB technology is driven by the miniaturization of components and semiconductor packages that supports advanced
features in revolutionary new products. This includes touch screen computing,military applications and avionics,4G network communications.